Radiation Tolerance for Space

Spirit Electronics is featured in an article about high-performance, radiation tolerant electronics for space in this month’s issue of Military & Aerospace Electronics magazine. Editor John Keller explores options for balancing costs, capability, size, weight and power consumption for new space designs:

“Among the approaches for producing space electronics components that blend affordability and capability is screening and testing to uncover those commercial grade-parts that can withstand space radiation on their own, as well as making some enhancements to electronics that testing identifies as already radiation tolerant.” 

Marti McCurdy, Spirit’s CEO, addresses test and value-add services that provide reliable yet affordable components.

“‘We are on the test side, and can upscreen or do any value-add for the customer,’ says Marti McCurdy, owner and CEO of Spirit Electronics in Phoenix. ‘We offer a high-value proposition, and only operate in the mil-aero sector.'”

Read the full article.

"In the test world, we are starting to move away from component-level and into the systems world... The commercial world has been in this area for a few years now, and the aerospace and defense market is just getting there now."

Efficient Step-down Voltage Conversion

TI TPSM53604 step-down power module

TI’s TPSM53604 is a 36-V, 4-A step-down power module shrinks solution size by 30% and delivers excellent thermal performance.

Thermal performance is an important aspect of any power converter design. TI’s new power module solves the thermal design challenge by integrating a very high efficiency IC inside a routable lead frame QFN-type package.

The TPSM53604 power module is a highly integrated 4-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5 mm x 5.5 mm x 4 mm, 15-pin QFN package uses routable lead-frame technology for enhanced thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.

The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53604 an excellent device for powering a wide range of applications.

Download the data sheet.

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