Yes, we do kitting!

Full Service, On-time Delivery

electronics assembly and kitting services

We act as the single source for all the components used on a project – labeled, prepared and delivered ready for manufacture on a date that suits your production schedule.

Assembly Services

  • Manufacturing and assembly of prototypes and production units

  • Reliability analysis, Guarantee Lot Qualification or fresh lot provided by Spirit

Spirit’s offering of assembly services through our trusted partners in the US includes our dual channel support of our franchised die sales plus assembly for our customers’ one stop shopping.  Spirit conforms to Trusted and ITAR regulations, as needed, for assembly in the US with prototype engineering units leading to full scale production assembly.  Our specialty with ceramic substrate design and organic substrate layout adds to our broad offering in a wide variety of package types.
 
Spirit Electronics uses packaging materials that meet the following Mil specs:
  • D4727
  • D4727M
  • D5118M
  • MIL-STD-3010 Method 3005

Package Types

  • QFN
  • QFP
  • PQFP/LQFP/TQFP
  • BGA
  • FBGA
  • Flip Chip
  • Chip on Board
  • SIP
  • MCM
  • PDIP
  • TQFP
  • PLCC
  • PGA
  • DIP
  • CERDIP
  • SOP/SSOP/TSOP/TSSOP
  • CSP
  • WLP