Package Types

Spirit's offering of assembly services through our trusted partners in the US includes our dual channel support of our franchised die sales plus assembly for our customers one stop shopping.  Spirit conforms to Trusted and ITAR regulations, as needed, for assembly in the US with prototype engineering units leading to full scale production assembly.  Our specialty with ceramic substrate design and organic substrate layout adds to our broad offering in a wide variety of package types.    


  • QFN
  • QFP
  • BGA
  • FBGA
  • Flip Chip
  • Chip on Board
  • SIP
  • MCM
  • PDIP
  • TQFP
  • PLCC
  • PGA
  • DIP
  • CSP
  • WLP