Wafer Sort

Spirit Electronics provides wafer sort to bin similar speed and performance die at wafer level.  Once properly binned, the die is prime for stacked die and multi-chip module applications thus reducing cost, reworks and low lot yields. 

Our approach to wafer probe encompasses a membrane probe card to ensure good contact without die pad damage.  Wafer dicing and pick & place from the die map produces a shipable waffle/gel pack of tested, known good die for easy assembly to our customer. 


Highlights

  • Wafer Speed Binning
  • Wafer Temperature Binning
  • Wafer "in family" data segregation
  • Known Good Die
  • Waffle/Gel Pack sorting