Failure Analysis for Discrete Electronic Devices
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Though perhaps not as glamorous as highly integrated microprocessors or specialized ASICs, discrete components – thin-film resistors, chip capacitors, individual transistors, and so on – are still a vital part of modern electronics. A failing bipolar transistor or shorted capacitor can be just as catastrophic as a malfunctioning IC; fortunately, the tools and techniques of IC failure analysis are equally applicable to FA of discrete components.
Discrete component failure analysis follows much the same path as an integrated circuit FA; indeed, analysis of a bipolar transistor or power MOSFET uses exactly the same tools, techniques, and procedures as more complex IC FA projects. Analysis of discrete components begins with non-destructive testing, where tools like x-ray imaging and acoustic microscopy are used to examine the device under test for damage or anomalous processing – for example, cracking in a ceramic capacitor, or irregularities in the laser trim on a precision metal film resistor. Next comes fault verification, where an analyst confirms that the reported problem – for example, a short circuit – is still present. After confirming the failure, the analyst applies a variety of different tools to perform fault isolation, identifying the most likely location of the defect. Depending on the type of device and the defect in question, different tools might be used. For example, thermal imaging is commonly used on leaky capacitors or thin-film resistors with anomalous values (either too high or too low of a resistance value may be the result of a defect that will emit heat when biased), while photoemission microscopy (PEM) often reveals defects on semiconductor-based discrete devices. Finally, destructive analysis and documentation wrap everything up neatly: protective coatings or passivation layers are stripped away, the defect is photographed in all its glory, and the root cause of the failure is identified.
From thermistors to capacitors, LEDs to FETs, and all points between, Spirit’s failure analysis expertise extends to all varieties of discrete components. Our suite of test equipment and preparation tools is adaptable across any range of different samples; regardless of your product, be confident that Spirit has the applicable experience and can successfully identify the source of your troubles.
- Determining the root cause of insufficient light output of LEDs
- Analyzing out-of-spec passives to determine lot disposition
- Post-mortem analysis of power semiconductor devices – MOSFETs, IGBTs, and others
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Device Analysis Applications
- Destructive Physical Analysis (DPA)
- Integrated Circuit Failure Analysis
- Discrete Electronic Devices
- MEMS Failure Analysis
- Destructive Analysis
- Construction Analysis
- PCB Quality Inspections
- Counterfeit IC Detection
- Microelectronics Inspections
- Package Integrity Testing
- X-Ray Inspections
- RoHS Auditing
- Wafer Lot Acceptance