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Electronics Analytical Services


Receive a comprehensive failure analysis with recommendations and visual proof to understand and correct the root cause of your electronics failure. Fast turnaround.


Reverse engineering tailored to your needs, budget, and schedule. Bring your manufacturing state-side, protect your patents/IP, replace obsolete parts, etc.


You need evidence to protect your intellectual property and patents. We have the expertise and equipment to dig into electronic components to get you that evidence.

Capabilities & Equipment

If your bottom line depends on high-quality analytical services, then a strong lab is your advantage. Choose an electronics analytical lab with a comprehensive set of analytical tools and techniques.

component screening and test services


  • Bench-top testing:  Curve Tracers, Logic Analyzer & Data Generator, Oscilloscope, etc.
  • Internal and external visual inspections
  • Acoustic Microscopy inspection
  • Real-Time X-ray Inspection
  • IR Microscopy (Thermal imaging)
  • X-ray Fluorescence (XRF)
  • Micro-FTIR (Organic substance identification)

Printed Circuit Board Assemblies

  • Visual Inspection (based on IPC specifications)
  • Cross-Sectioning
  • Potted Cross-Sectioning
  • Thermal (IR) Imaging
  • Dye and Pry (BGA package) Solderability Analysis
  • Hi-Pot & Insulation Resistance Testing
  • Heat Resistance, Solderability, etc.
  • High-speed & Low-Speed, Diamond Saws
  • Parallel Lapping

ICs, Discretes, Semiconductors

  • Cross-Sectioning
  • Potted Cross-Sections
  • Deprocessing – wet, dry and parallel lapping
  • Plastic Package Decappers 
  • Probe Station 
  • IR (thermal) Microscopy
  • SEM Inspection 
  • Focused Ion Beam (FIB) editing
  • FIB Cross-Sections
  • FIB TEM Prep and STEM/TEM Imaging
  • Photon Emission Microscopy (PEM aka LEM and EMMI)
  • Dry etching (oxides and package decaps)

Counterfeit Analysis

  • Visual Inspection: Device markings, dimensions, lead finish, remarking
  • Datasheet comparison
  • X-Ray inspection
  • XRF inspection (RoHS)
  • Acoustical inspection
  • Decapsulation
  • Die inspection (low-mag, high-mag)
  • SEM inspection
  • Electrical Testing  (bench-top)
  • Cross-sectioning 
  • Deprocessing
  • Energy Dispersive Spectroscopy (EDS), Elemental Analysis
  • Custom solutions available