Electronics Analytical Services
FAILURE ANALYSIS
Receive a comprehensive failure analysis with recommendations and visual proof to understand and correct the root cause of your electronics failure. Fast turnaround.
REVERSE ENGINEERING
Reverse engineering tailored to your needs, budget, and schedule. Bring your manufacturing state-side, protect your patents/IP, replace obsolete parts, etc.
IP ANALYSIS
You need evidence to protect your intellectual property and patents. We have the expertise and equipment to dig into electronic components to get you that evidence.
Capabilities & Equipment
If your bottom line depends on high-quality analytical services, then a strong lab is your advantage. Choose an electronics analytical lab with a comprehensive set of analytical tools and techniques.

Non-Destructive
- Bench-top testing: Curve Tracers, Logic Analyzer & Data Generator, Oscilloscope, etc.
- Internal and external visual inspections
- Acoustic Microscopy inspection
- Real-Time X-ray Inspection
- IR Microscopy (Thermal imaging)
- X-ray Fluorescence (XRF)
- Micro-FTIR (Organic substance identification)

Printed Circuit Board Assemblies
- Visual Inspection (based on IPC specifications)
- Cross-Sectioning
- Potted Cross-Sectioning
- Thermal (IR) Imaging
- Dye and Pry (BGA package) Solderability Analysis
- Hi-Pot & Insulation Resistance Testing
- Heat Resistance, Solderability, etc.
- High-speed & Low-Speed, Diamond Saws
- Parallel Lapping

ICs, Discretes, Semiconductors
- Cross-Sectioning
- Potted Cross-Sections
- Deprocessing – wet, dry and parallel lapping
- Plastic Package Decappers
- Probe Station
- IR (thermal) Microscopy
- SEM Inspection
- Focused Ion Beam (FIB) editing
- FIB Cross-Sections
- FIB TEM Prep and STEM/TEM Imaging
- Photon Emission Microscopy (PEM aka LEM and EMMI)
- Dry etching (oxides and package decaps)
- SIMS and TOF-SIMS

Counterfeit Analysis
- Visual Inspection: Device markings, dimensions, lead finish, remarking
- Datasheet comparison
- X-Ray inspection
- XRF inspection (RoHS)
- Acoustical inspection
- Decapsulation
- Die inspection (low-mag, high-mag)
- SEM inspection
- Electrical Testing (bench-top)
- Cross-sectioning
- Deprocessing
- Energy Dispersive Spectroscopy (EDS), Elemental Analysis
- Custom solutions available