Electronics Analytical Services
If your bottom line depends on high-quality analytical services, then a strong lab is your advantage. Choose an electronics analytical lab with a comprehensive set of analytical tools and techniques.
- Bench-top testing: Curve Tracers, Logic Analyzer & Data Generator, Oscilloscope, etc.
- Internal and external visual inspections
- Acoustic Microscopy inspection
- Real-Time X-ray Inspection
- IR Microscopy (Thermal imaging)
- X-ray Fluorescence (XRF)
- Micro-FTIR (Organic substance identification)
- Visual Inspection (based on IPC specifications)
- Cross-Sectioning
- Potted Cross-Sectioning
- Thermal (IR) Imaging
- Dye and Pry (BGA package) Solderability Analysis
- Hi-Pot & Insulation Resistance Testing
- Heat Resistance, Solderability, etc.
- High-speed & Low-Speed, Diamond Saws
- Parallel Lapping
- Cross-Sectioning
- Potted Cross-Sections
- Deprocessing – wet, dry and parallel lapping
- Plastic Package Decappers
- Probe Station
- IR (thermal) Microscopy
- SEM Inspection
- Focused Ion Beam (FIB) editing
- FIB Cross-Sections
- FIB TEM Prep and STEM/TEM Imaging
- Photon Emission Microscopy (PEM aka LEM and EMMI)
- Dry etching (oxides and package decaps)
- SIMS and TOF-SIMS
- Visual Inspection: Device markings, dimensions, lead finish, remarking
- Datasheet comparison
- X-Ray inspection
- XRF inspection (RoHS)
- Acoustical inspection
- Decapsulation
- Die inspection (low-mag, high-mag)
- SEM inspection
- Electrical Testing (bench-top)
- Cross-sectioning
- Deprocessing
- Energy Dispersive Spectroscopy (EDS), Elemental Analysis
- Custom solutions available