Screen & Qualification
Test Services
Spirit is DLA Qualified for Commercial Lab Suitability for MIL-STD-883
Our engineers are experienced in high-speed digital, mixed signal, analog, RF and SOC test-program development. Our team of experienced engineers will work seamlessly with you and your team to help meet your market challenges.
Wafer Test & Sort
Spirit Electronics provides wafer sort to bin similar speed and performance die at wafer level. Once properly binned, the die is prime for stacked die and multi-chip module applications thus reducing cost, reworks and low lot yields.
Our approach to wafer probe encompasses a membrane probe card to ensure good contact without die pad damage. Wafer dicing and pick & place from the die map produces a shipable waffle/gel pack of tested, known good die for easy assembly to our customer.
Spirit offers a vast array of electrical test services to meet the application specific need for the complexity of the wafer under test. Our offering utilizes the best cost effective tester for the die size, number of touch downs and performance, to maximize rate of return and optimization of test coverage per the data sheet.
Electrical test at three temperatures is uniquely specified to cover additional parameters to insure the quality and integrity of the die being used in critical applications.
- Wafer Speed Binning
- Wafer Temperature Binning
- Wafer “in family” data segregation
- Known Good Die
- Waffle/Gel Pack sorting
- Function Tests
- AC parameters
- DC parameters
- Application specific I/O test
- Customer configured testing
- Data sheet verification
- Anti-counterfeit validation
Electrical Testing
Spirit has a vast array of Automated Test Equipment (ATE) to meet the application specific need for the complexity of the device under test (DUT). Our offering utilizes the best cost effective ATE for the DUT in order to maximize rate of return and optimization of test coverage per the data sheet.
Electrical test data, tested over three temperatures, is uniquely specified to cover additional parameters to insure the quality and integrity of the device being used in critical applications. Electrical test provides additional data to validate flight units for the life of the mission.
High Speed Test
RF Testing
Passive and Discreet Tests
EPROM Programming
Three Temp Testing at Speed
FPGA
ASIC
RF Components
Hi Speed Transceivers
Analog
Digital
Mixed Signal
Microprocessors
ADC/DAC
Environmental, Reliability &
Radiation Testing
Environmental Testing
Our Environmental Testing capabilities include:
- Highly Accelerated Stress Test (HAST)
- High and Low Temperature Operating Limits (HTOL/LTOL)
- High Temperature Storage Life (HTSL)
- Temperature Humidity Bias (THB)
- Others
Reliability Testing
Our Reliability Testing capabilities include:
- Accelerated Evaluation & Qualification
- Advanced Chamberless Burn-in (RF device testing)
- Board-level Solder Joint Reliability
- High-reliability Qualification
- Device characterization / Feasibility Analysis
- Multiple package/product evaluation
- High-powered, liquid and RF burn-in
Key Reliability Test Services
- Acoustic Microscopy
- Autoclave
- Ball / Die Shear
- EFR Analysis
- ESD/Latch-up
- Fine/Gross Leak — Kr85
- Particle Impact Noise Detection (PIND)
- Salt Atmosphere
- Shadow Moiré/Warpage Analysis
- Solderability
- Temperature/Power Cycle Operating Life
- Thermal Shock
- X-Ray
- Other Level III & Sub System
Support Services
- Chip Removal and Re-assembly for RAD Testing
- Backside Chip Thinning and Re-assembly for Heavy Ion Radiation testing
- PC Board Design, Quick-Turn Prototyping and Assembly
- Radiation Test Engineering support including test plan development and test result reports.
Radiation Effects Testing
Spirit Electronics offers comprehensive radiation effects testing and support services, from electrical test, beam time, hardware and software development.
Our MIL-STD Radiation Effects Test services include:
- Determine the effects of gamma radiation on microelectronics and photonics components and systems.
- Total Ionizing Dose (TID) and Device Testing per MIL-STD-750, MIL-STD-883, Method 1019 and ASTM F1892.
- Enhanced Low Dose Radiation Sensitivity (ELDRS) Testing
- 14 MeV Neutron Irradiator. Testing per MIL-STD-750 and MIL-STD-883, Method 1017
- Radiation Lot Acceptance Testing (RLAT)
- Heavy Ion Single Event Effects or SEE: Single Event Latch Up (SEL), Single Event Upset (SEU), Single Event Transient (SET), Single Event Burnout (SEB) and Single Event Gate Rapture (SEGR) – EIA/JESD 57, ASTM F1192
- Radiation Engineering and Component Qualification Planning
- Wafer Lot Radiation Screening, Characterization, and Qualification
- MIL-STD-750 and MIL-STD-883 Screening, Reliability and Qualification of COTS Devices, FPGA’s as well as ASIC Design Engineering for Radiation Hardened Devices.
Test & Inspection
Test and inspection capabilities at Spirit Electronics play an important role in the development of processes and testing of microsystem package assemblies. By using Environmental Life Testing and Test and Inspection in conjunction with a Test Early-Test Often approach in the product development cycle, weaknesses in the design are found early, before too much value is added to the part.
Precision Pressure Sensor Testing Application Brief
In the ever expanding pressure sensor market, MEMS-based sensors are driving the market to higher levels of precision and accuracy with faster response times at lower cost. Medical applications for both diagnostics and treatment benefit from these technical advances. When measuring pressure of fluids in the body (eg., blood) with minimally invasive techniques, precision and accuracy at relatively low pressures (<3 psi) are critical.
Precision Measurement Specifications
- Programmable high-speed three axis non-contact and contact coordinate measuring machine
- A2LA calibrated and certified
- 250 x 200 x 200 mm measuring envelope
- Non-Contact vision measurement capable
- 1x and 5x lenses
- Vision Measurement Accuracy
- XY-axis: (2.0 + 3L / 1000) µm
- Z-axis: (3.0 + 5L / 1000) µm
- Contact touch probe measurement capable
- Renishaw standard force and low force modules
- Touch Measurement Accuracy
- XYZ-axis: (2.4 + 3L / 1000) µm
Acoustic Microscopy Specifications
- Available transducers: 15Mhz, 30MHz, 50MHz, 75MHz, 100MHz, 230MHz
- Imaging techniques available: Surface, Interface, Bulk, Loss of back echo, tray scanning, Q-BAM, Thru-scan, STAR Mode, and virtual rescanning
- 12” x 12” scan area
- Up to 16K x 16K (268 Megapixels) Very High-Res (VHR™) Enhanced Scanning and Data Acquisition Format with Zoom Enlargement (4K x 4K standard)
- Acoustic Impedance Polarity Detector simultaneously displays both phase (i.e., polarity) and amplitude information
Scanning Electron Micoscopy (SEM) Specifications
- Resolution: 4nm @ 1kV, 1.5nm @ 15kV
- Imaging field: 3.5mm
- Sample size: 50mm diameter max
- Electron gun: cold-cathode field emission
- Robinson Backscattered Electron (BSE) detector
- X-ray EDS
3D X-Ray Specifications
- µCT technique to create 2D X-ray slices in any plane of a printed circuit board assembly without the need to cut the board
- 160 kV Tube with up to 10 W Tube Power
- Nordson DAGE 2 Mpixel @ 25fps XiDAT3 Digital Image Intensifier with Real Time Image Enhancements
- Geometric Magnification 2,000x, System 12,000x and Total 60,000x with Digital Zoom
- Maximum Board Size: 29” x 22.8” (736 x 580 mm)
- 70° Oblique Views without Loss of Magnification
Pressure Controller Specifications
- Fully integrated multi-range pressure test and calibration system
- 12 range system for maximum performance and coverage
- Pressure ranges to 2,500 psi (170 bar)
- Internal vacuum pump for absolute mode and negative gauge mode operation
- Control stability:
- 0.0015 psi from 0.15 psia to 14.3 psia
- 0.0001 psi from 0 psig to 10 psig
- 0.0015 psi from 10 psig to 150 psig
- 0.25 psi from 150 psig to 2,500 psig
- Automatic range switching
- High speed pressure control provides increased throughput
- Datalogging and automated calibration sequences
Interferometry Specifications
- Characterizes and quantifies topographical features
- Surface Roughness
- Step Height
- Critical Dimensions
- Non-Destructive Tests
- Profile heights ranging from < 1 nm up to 20000 µm
- Vertical Scan Range 150 µm
- Max Scan Area 20 µm
- Maximum Sample Size 89 x 203 x 203 mm
- RMS Repeatability < 0.01 nm (0.0004 µin) RMSσ
- Step Height Accuracy ≤ 0.75% Repeatability ≤0.1% @ 1σ
- 5x Objective, 20x Objective, 10x Glass Compensated Objective
Bond Testing Specifications
- Perform destructive and non-destructive force testing to bonds
- Export data and reports into Word, Excel, and .csv
- Customizable data tables and graphs
- Fitted with top down camera for inspection pictures after bond test is performed
- Currently available test cartridges:
- T1KG – Tweezer and stud pull up to 1 kilogram
- S250G – Shear up to 250 grams
- S50KG – Shear up to 50 kilograms
- P100G – Hook pull up to 100 grams
- PP50KG – Push/Pull up to 50 kilograms
- Accuracy +/-0.1% of the full scale for the selected range
- Step Height Accuracy ≤ 0.75% Repeatability ≤0.1% @ 1σ