Analytical Techniques

Today’s semiconductors and electronic devices are in a constant state of evolution. With this evolution comes ever-increasing complexity in both manufacturing and analysis. To address this reality, Spirit maintains a comprehensive set of analytical tools and techniques both in-house at our facility and through a network of highly qualified partner labs.

Our Capabilities

Initial inspections often utilize a number of non-destructive techniques including:

• X-ray Inspection, 2-D Real-Time, and 3-D*
• Scanning Acoustic Microscopy Services (including c-mode scanning)
• Optical Inspection (Dark Field, Bright Field, Polarized, High-Resolution Mosaic Functionality)
• Electrical Test Equipment
• Infrared (IR) Microscopy
• X-ray Fluorescence (XRF)
• Fourier Transform Infrared (FTIR)
• Energy Dispersive Spectroscopy (EDS)
• Hi-pot and Insulation Resistance Testing

Deep dive failure analysis requires a variety of more invasive or destructive techniques, including:

• Dual-Beam FIB
• Cross Sectioning of ICs and PCBs (Mechanical and FIB)
• FIB Editing*
• Scanning Electron Microscopy Lab (SEM and FE-SEM)
• IC Deprocessing, including:
  • Parallel Lapping
  • Dry and Wet Etching
  • Reactive Ion Etching
• STEM Prep and Imaging
• Dye and Pry (BGA devices)
• Decapping and depotting (ICs)
• Solderability Analysis

For fault isolation, Spirit relies on a variety of techniques, including:

• Photo Emission Microscopy (PEM)
• Liquid Crystal Analysis
• LIVA/TIVA Analysis
• Thermal Imaging
• Electrical Probing