Litigation Support for Microelectronics IP/Patent Infringement
Spirit Electronics specializes in providing semiconductor patent infringement and intellectual property (IP) infringement analysis, reverse engineering and teardown services for litigation support.
Semiconductor patent and IP litigation are complicated and time-consuming processes. If you are facing a challenging electronic component infringement or IP court battle, you will need reverse engineering and/or teardown services that produce detailed, accurate and clear reports to leverage in court.
Effective Analysis, Done On Time
Our electronics teardown facility is equipped with modern equipment and skilled electronic engineers to provide you with world-class analysis for patent and IP infringement related to semiconductor design, construction, programming and end-use.
The end product you receive from our semiconductor patent and IP infringement engineering services is a detailed, easy-to-understand litigation report that includes high-resolution photos and analytical data. Our patent and IP infringement services are always delivered in a prompt, competitively priced and unbiased manner. We focus on ensuring repeatable and defensible results.
Semiconductor Teardown for Litigation Support
To perform your semiconductor teardown for litigation support, our engineers will use both non-destructive and invasive techniques to produce a detailed analysis report of the components, composition and design features of the device.
The detailed analysis report you receive will be custom-tailored to your unique needs. To ensure we capture your specific needs you will communicate directly with an electrical engineer with years of experience in all aspects of semiconductor and integrated circuit analysis.
Our Facility and Analytical Techniques
To perform your semiconductor teardown for patent and IP assessment, we bring a team of expert electrical engineers and a facility full of modern electronic analysis equipment to the table.
Below is a list of the comprehensive set of analytical tools and techniques we provide both in-house at our facility and through a network of highly qualified partner labs.
- X-ray Inspection, 2-D Real-Time, and 3-D*
- Scanning Acoustic Microscopy (SAM) including c-mode scanning
- Optical Inspection (Dark Field, Bright Field, Polarized, High-Resolution Mosaic Functionality)
- Infrared (IR) Microscopy
- X-ray Fluorescence (XRF)
- Fourier Transform Infrared (FTIR)
- Energy Dispersive Spectroscopy (EDS)
- Hi-pot and Insulation Resistance Testing
- Cross Sectioning of ICs and PCBs (Mechanical and FIB)
- Scanning Electron Microscopy (SEM and FE-SEM)
- IC Deprocessing including Parallel Lapping, Dry and Wet Etching & Reactive Ion Etching
- STEM Prep and Imaging
- Dye and Pry (BGA devices)
- Decapping and Depotting (ICs)
- Solderability Analysis
- Photo Emission Microscopy (PEM)
- Liquid Crystal Analysis
- LIVA/TIVA Analysis
- Thermal Imaging
- Electrical Probing
Semiconductor Reverse Engineering for Patent Infringement
Semiconductor reverse engineering for litigation involves system-level analysis, hardware, circuit extraction, taking the semiconductor down to the transistor level and working back up through the interconnects to create schematics, process analysis, construction, materials and end-use.
Spirit’s electronics experts can tackle reverse engineering for patent infringement challenges related to semiconductors, printed circuit boards (PCB), integrated circuits (IC) and consumer electronics.
Our electronics reverse engineering services are designed to help companies gather evidence to support litigation. We can work with your patent documents, lawyer-specified protocols, and/or subject matter experts to provide the critical data needed to support your legal case.
Device Analysis Applications
- Destructive Physical Analysis (DPA)
- Integrated Circuit Failure Analysis
- Discrete Electronic Devices
- MEMS Failure Analysis
- Destructive Analysis
- Construction Analysis
- PCB Quality Inspections
- Counterfeit IC Detection
- Microelectronics Inspections
- Package Integrity Testing
- X-Ray Inspections
- RoHS Auditing
- Wafer Lot Acceptance