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Ep. 33: How Automation Offers Precision in BGA Reballing

Get the inside scoop on industry news and technology!

In this podcast, Spirit Electronics CEO Marti McCurdy talks with aerospace and defense experts about high-reliability components and industry-rocking topics affecting the supply chain.

Marti is back with Tracey Latham to discuss how high-tech automated assembly can change the game with BGA reballing. Spirit’s new process starts with robotic ball removal, and then our in-house partner Latham Industries uses their advanced assembly line equipment to place the new balls on the BGA.

The power of automation to control the ball placement and inspect the BGA really shines throughout this process. Marti & Tracey discuss each step of the Latham line, including:

  • 3S printer for solder paste application
  • 10-nozzle pick-and-place of new balls
  • 10-zone KIC-controlled oven reflow
  • Deionized wash
  • Final ball scan

Automated BGA reball includes detailed inspection at each step of the process to avoid rework and damage. The result is a leaded BGA solution, fully tested and ready for production. Your BGA never leaves our facility, protecting it from shipping delays, handling damage and ESD and environmental damage.