Spirit Electronics Wins Silver Award at BAE Systems Partner 2 Win Supplier Symposium

Spirit Wins BAE Partner 2 Win Supplier Award 2023

CEO Marti McCurdy, Dir. of Program Management Ivan Santana and Dir. of Technical Sales Sean MacDonald accept the BAE Partner 2 Win award in Austin, Texas.  

Spirit Electronics achieved a Silver Supplier award at the 2023 BAE Systems Partner 2 Win Supplier Symposium in Austin, Texas. CEO Marti McCurdy, Director of Program Management Ivan Santana and Director of Technical Sales Sean Macdonald attended the awards ceremony to receive the award on behalf of the Spirit team. Spirit was among 55 Gold and Silver Suppliers recognized at the event.

“We are happy to have our efforts to support the defense supply chain recognized for yet another year,” says Spirit CEO Marti McCurdy. Spirit has been an award-winning BAE supplier for the six years since McCurdy took the helm. “BAE truly approaches the supply chain with partnership in mind, and we have worked hard to build a supplier relationship with them that continues to deliver quality products that fit their program needs,” she says.

Spirit Electronics is among 816 small and diverse businesses in the BAE supply chain, which will spend over 2 billion dollars in 2023. BAE’s small business commitment states, “We recognize that small business partners contribute to our innovative processes, support of the war fighter, job creation and the overall economic health of United States economy.” As a veteran-owned, woman-owned, HUBZone small business employing multiple veterans, supporting military and defense programs is particularly important to the Spirit team.

Spirit Electronics serves as an authorized distributor for electronic components for BAE Systems, as well as offering value-added services essential to the defense supply chain such as ASIC design and logistics, MIL-STD-883 reliability testing and circuit card assembly.

Lockheed Martin Space Outstanding Small Business for 2022

Lockheed Martin Outstanding Small Business 2022

Spirit Electronics is proud to announce its selection as an Outstanding Small Business for Lockheed Martin’s Space division for 2022. One of only five suppliers in the country to receive the award, Spirit achieved 100% on-time-delivery and 99.45% quality scores. Spirit provides Lockheed Martin Space with authorized distribution and full-turnkey test and assembly for microelectronics and semiconductors.

The Lockheed Space division estimates it will spend approximately $5.4 billion in 2022 with small businesses, generating economic growth and taking advantage of small business strengths in innovation and agility. Lockheed Martin Space’s Orion program alone includes 2,900 suppliers, with approximately 50% being small businesses like Spirit.

“This is truly a team effort to win service awards and recognition from our customers,” says Spirit CEO Marti McCurdy. “From our dedicated account representatives to our sales and purchasing, our warehouse inspectors, our lab, our quality and even admin teams, everyone at Spirit pours excellence into their work. It shows in our processes, customer satisfaction and relationships.”

Spirit is a woman-owned, veteran-owned and HUBZone certified small business. In the past 5 years, the team has grown from under ten to more than thirty employees. Spirit purchased and renovated a 16,000sf facility in a historically underutilized business zone in Phoenix in 2019. Spirit expanded from its roots as an authorized microelectronics and semiconductor distributor to offer MIL-STD-883 testing services, BGA solder exchange and an in-house circuit board assembly line.

“This team truly embodies the tenacity and personal service of a small business,” says McCurdy. “We are on a mission to redefine the supply chain by bringing multiple services and efficiency under one supplier for our customers, and this award shows we are achieving that with the best quality of service.”

Spirit: Behind the Screen Podcast, Episode 2

Behind the Screen Podcast 2

Zef Malik and the DDR4: Can Your Product Perform?

In this new episode of our Spirit: Behind the Screen! podcast, Zef talks with Marti McCurdy about why the Aerospace and Defense market needs to test DDR4 at high speeds, temps and conditions to guarantee optimal performance in military applications. And it needs an expert understanding of the product to make that happen. They also discuss how testing in A&D needs to shift from individual parts to System Level Testing (SLT) to keep up with the millions of possible combinations a chip may see on a board. 

Listen in!

Rugged Cable Assemblies for Extreme Conditions

MilesTek rugged cable assemblies for extreme conditions

Ethernet and USB applications located in harsh industrial and military environments call for rugged cable assemblies that will stand up to extreme conditions. To support these applications, MilesTek has just launched a new series of Ethernet and USB cable assemblies that feature a Glenair Mighty Mouse connector on one end of the assembly.

At just half the size and weight of a D38999 connector, the high-performance Mighty Mouse connector is specified on hundreds of mission-critical interconnect applications worldwide and has become the de facto high-performance connector solution for many former users of the D38999 connector.

Features Include:

  • Low smoke zero halogen (LSZH) or PVC jackets
  • Male and female Mighty Mouse connector options
  • Mighty Mouse connectors are IP67 rated even when unmated
  • Ethernet Cat5e and Cat6 options
  • Cable shielding provides EMI/RFI resistance

All assemblies are in stock and available with same day shipping. Spirit Electronics is MilesTek’s only authorized U.S. Distributor!  Contact us today for a quote.

Micron 2300 & 2210 QLC NVMe SSDs Now Available

Micron SSD

Micron has announced the immediate availability of the Micron 2300 and Micron 2210, two new NVMe M.2 SSDs designed for client computing applications. The Micron 2300 SSD is ideal for compute-heavy applications while the Micron 2210 combines NVMe performance with low-cost QLC NAND for a very affordable overall price point.

Both SSDs leverage Micron’s 96-layer 3D NAND technology, which combines power-savings, up to 2TB in capacity, and a compact form factor for flexible deployment. Micron also indicates enhanced client security features and capabilities for protecting data as well as TCG Opal 2.0 and TCG Pyrite 2.0 support.

The Micron® 2300 SSD combines the power and density needed to drive compute-heavy applications in a compact form factor with the reduced power consumption modern mobile users demand. For the first time, Micron brings together NVMe performance and low-cost quad-level-cell (QLC) NAND in the Micron® 2210 QLC SSD. It combines fast NVMe throughput and Micron’s leadership in QLC technology to offer flash capabilities at hard disk drive-like price points while reducing power consumption by 15 times when compared to hard drives.

Components for Military & Space Electronics (CMSE)

24th Annual Components for Military & Space Electronics Conference & Exhibition

24th Annual Components for Military & Space Electronics Conference & Exhibition24th Annual Components for Military & Space Electronics (CMSE) Conference & Exhibition

UPDATE: This event has been canceled due to the COVID-19 pandemic. 
Please save the date for April 20-22, 2021.

CMSE is the premier event focused on the design, reliability, and application of electronic components for use in avionics aerospace, military & commercial space systems.

 Visit Spirit Electronics at the CMSE exhibits on April 22-23, 2020 at Four Points by Sheraton (LAX) Los Angeles, California. Please arrange a meeting with Team Spirit to learn about our line card, value-added services and capabilities. We look forward to seeing you there!

Military Ready Triaxial & Twinaxial Patch Panels

Military ready triaxial and twin axial patch panels from MilesTek

MilesTek has released a new series of triaxial and twinaxial patch panels and universal sub-panels to address mil/aero connectivity applications. 

This new panel series includes a variety of universal sub-panels with TRB and TRT feed-through jacks and options that include 12” leads on the back of the panels. Custom length leads are also available upon request. These universal sub-panels are designed to fit into MilesTek’s 6-bay universal master rack panel which can house a wide variety of interconnect options.

Additionally, MilesTek now stocks both 1U and 2U, TRB and TRT patch panels designed to fit into 19” equipment racks and enclosures. These new patch panels feature .06” cold rolled steel and are RoHS compliant.

Call for a quote today!

An Approach to Capacitor Failure Analysis

The humble capacitor is one of the most fundamental components of any electronic assembly. These ubiquitous passive devices come in a variety of different flavors; whether formed using electrolytic fluids, metal foils, the metals and oxides of an integrated circuit, or any of a multitude of other materials, there is hardly a printed circuit assembly in the world without at least one capacitor mounted somewhere on its surface. Capacitors form the backbone of charge pumps, frequency filters, power conditioners, and many other common applications; since these components are so crucial to these operations, a malfunctioning capacitor can often cause complete failure of a system. At first blush, a capacitor would seem to be a fairly straightforward device to perform analysis on (after all, how complex can two electrodes separated by a thin dielectric be?), capacitor failure analysis poses unique challenges that must be met with equally unique approaches.

As with any project, the ultimate goal in capacitor failure analysis is determining a root cause for failure – in other words, finding whether the improper operation is due to manufacturing imperfections, end-user abuse, or other factors. Just as with an integrated circuit, the first step in the process is determining where an analyst should even begin looking for a failure; after all, failing capacitors rarely give outward indication that they have malfunctioned (though an exception can be found with polarized electrolytic capacitors, which have a tendency to explode violently when abused, much to the chagrin of many an inattentive engineering student). The same set of tools that an analyst uses to ferret out defects on an integrated circuit can also be applied to the analysis of a capacitor, with the addition of a little creativity.

The most common failure mechanism for capacitors is a compromised dielectric causing leakage between the capacitor’s two electrodes. Depending on the type of capacitor, this dielectric may take many forms; one of the most common capacitors, the multi-layer ceramic capacitor often referred to as a chip cap, uses a ceramic material comprised of small particles of various materials blended to achieve a desired set of characteristics. In this type of capacitor, the most common failure is cracking or delamination of the capacitor’s internal layers. An acoustic microscope can be used to detect these damaged dielectrics, just as it might find delamination in an encapsulated integrated circuit; analyzing a capacitor acoustically, however, does not necessarily follow the same course as analyzing a packaged IC.

In a packaged IC, there are two primary acoustic techniques for determining the condition of a package; a plan-view image of the device (referred to as a C-Mode image), and comparisons of the reflected acoustic wave at several points (known as A-Scans). The C-Mode image contains data about a small handful of interfaces within the package (e.g. the die-to-encapsulant interface, or the encapsulant-to-leadframe interface), while variations in phase and amplitude on the A-Scan can be used to identify differences between points that might indicate a defect. A chip cap has many more interfaces than an integrated circuit, with multiple layers of metal and ceramic stacked upon one another; the C-Scan can really only be used to look at one of these interfaces at a time, and as such is not an ideal approach to analyzing the entire device. For a ceramic capacitor, the appropriate technique is a tomographic approach known as a B-Scan – a technique which provides cross-sectional images of the entire thickness of the device.

Using a B-Scan, it is not only to determine the presence of a damaged dielectric in the capacitor, but also its relative location in the device, facilitating a targeted cross-section. Since many capacitor failures result in increased leakage current, many integrated circuit techniques for isolating leakage translate directly to capacitor analysis. While techniques steeped in semiconductor physics like photoemission are of limited utility for capacitor failure analysis, methods of isolating current flow by its secondary effects, like thermal imaging, are more than capable of identifying dielectric pinholes or other leakage sites.

Since these techniques often rely on line-of-sight, they are more useful as a secondary confirmation of a failure, correlating an electrical signature to a physical defect revealed during deconstruction or cross-section of a device. The failures here are only a small incursion into the realm of capacitor failure analysis. Indeed, even devices as seemingly humdrum as the simple capacitor can make for exciting failures; leaking electrolytic capacitors may cause catastrophic failure in the form of burnt circuit boards, tantalum capacitors may explode in a shower of sparks, and high voltage capacitors may break down with a thunderous crack. Despite their simplicity, failure analysis on capacitors is a complex, yet worthwhile endeavor, even if the end result is only an improvement in product reliability instead of the aversion of an uncontrollable conflagration.