TI’s TPSM53604 is a 36-V, 4-A step-down power module shrinks solution size by 30% and delivers excellent thermal performance.
Thermal performance is an important aspect of any power converter design. TI’s new power module solves the thermal design challenge by integrating a very high efficiency IC inside a routable lead frame QFN-type package.
The TPSM53604 power module is a highly integrated 4-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5 mm x 5.5 mm x 4 mm, 15-pin QFN package uses routable lead-frame technology for enhanced thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.
The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53604 an excellent device for powering a wide range of applications.
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